Chemical Mechanical Planarization

Chemical Mechanical Planarization

Our next-generation silica sols are designed to enable significant removal rate, surface finish and planarization improvements, as well as to meet the broader technical requirements of our customers. The abrasive particles have a size distribution, hardness, morphology and surface profile which directly affect critical metrics, including removal rate and wafer defects. 

For customers with interest in our colloidal silica products, please contact the Colloidal Technologies Group directly at CTGmarketing@ecolab.com for assistance.